Pick & Place Handlers: Features Comparison

Below is a comparison of major features between the Exatron 904 and other popular Pick and Place Machines.
To learn more about our Used Exatron 904 for sale, CLICK HERE.



Exatron 904
(Click to see our Used Exatron 904 for sale)
SPEA H3500 Series Xcerra MT9510 XP Tesec 4664-IH Chroma 3260 Advantest M4871
SPECIFICATIONS
Package/Device Types handled SMD and leaded device types:  
BGA, CSP, DIP, Flat Pack, LCC, LGA, MSOP, PCB, PGA, PLCC, QFP, SIMM, SIP, SIMM, SODIMM, SOIC, SSOIC, TSSOP, and custom devices
QFP, LGA, QFN, BGA, with or without leads DIP, BGA, PGA, SO, QFP, QFN, LGA, TO, CLCC, PLCC, MCM, WLP LGA, BGA, CSP BGA series, μBGA, PGA, QFP series, CSP, BCC, QFN, Flip-Chip, TSOP BGA, CSP, WLCSP, QFP, TQFP, SSOP, TSOP, QFN and others
Device Size 1.6x2.00mm to 75x75mm 1x1mm to 40x40mm 2x2mm to 70x70mm 2x2mm or larger 7x7mm to 45x45mm Precise alignment capability allows handling of fine-pitch semiconductors and devices with both top and bottom-side contacts
DUT Capacity 16 - loads 2 groups of 8 devices each 1-50 devices N/A 2-96 devices 6 devices 16 devices
Test sites Single site standard Up to 200 sites parallel test Up to 8 contact sites parallel test
(4 horizontal sites)
16 sites parallel test 6 sites parallel test 16 sites parallel test
Option: 32
Test Contactors/Sockets Supports nearly all OEM test sockets
Exatron custom built spring probe sockets
Exatron Particle Interconnect (PI) RF and CSP sockets

SPEA test cells: provide direct connection between tester and DUT. Wide Range of stimulus units available
Contacting: standard, high frequency and Kelvin

Sockets from other suppliers may be used (Yamaichi,  
Synergetix, JTI, Enplas, Aries, OzTek, Seiken)
N/A N/A N/A
Types of Input/Output JEDEC Tray (all formats, 2"" and 4"" waffle packs)

Options: tape, tube, bulk, bowl feeder, magazine
Input: Tray (8” wafer size (predisposed for 12”), Bulk (bowl feeder), Wafer
Output: Tray, Tape/Reel, Bulk
JEDEC Tray JEDEC Tray JEDEC and EIAJ

Standard: JEDEC Tray


Option: EIAJ

Applicable Trays
Loader / Unloader
Input: 1
Output: 4
Up to 80 trays Tray to tray transfer

Tray stack, separate input/output tray loop
Tray to tray transfer

Input / Empty tray : 130-143mm (D) 310-330mm (W)

Output tray : 135-150mm (D) 290-330mm (W)

N/A
Test interface / Communications Standards TTL Handler port, RS-232, GPIB, TCP/IP, Ethernet and SECS/GEM TCP/IP, IEEE488, RS232 and
TTL I/O
Available Options: SECS-II / GEM N/A Standard RS-232,
Optional GPIB,USB and TTL
Standard: GPIB
Jam Rate 1/5,000 < 1:10,000 N/A N/A 1/3,000 N/A
Placement Force Up to 10kg (20 lbs) force with standard pickup heads N/A N/A N/A Up to 60 Kgf (accuracy ±1kgf ) by servo motor (80 Kgf for Option) N/A
Dimensions Gantry: 1219mm (48in.) 2200x1400mm (tray to tray) N/A N/A

2570mm (W)

1360mm (D)

1780mm (H)

1530mm (W)

1030mm (L)

1765mm (H)

Test capacity 16 devices every 8s N/A Index time: 0.38s Index time: 6s (1.5s in pitch sending test)

Cycle time:  10s (Test time including 4s)
Index Time: 3.0s (excluding test communication time)

One site cycle time: 3.5s
Index Time: 0.87s
Throughput 7,200 UPH up to 33,000 UPH up to 5,300 UPH 19,200 UPH N/A 15,000 UPH
MEMS testing Capable of testing MEMS devices using different stimulus Avilable module that can test MEMS devices using different stimulus MEMS test option available in combination with Xcerra sensor test modules Capable of MEMS device test: Gyroscope or Accelerometer Capable of MEMS device test: Microphone, Accelerometer N/A
Tri-temp IC Test Option Can be integrated into the system - contact Exatron -40 to +180 °C, ±0,5 - 2 ºC -55 °C to +155 °C
+175 °C option
-40°C to +125°C, +/- 1℃
-55°C to +150°C option
-40°C to +125°C -40°C to 125°C ±1°C (with Tpusher sensor)